SMP18 Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

SMP18

Octal Sample-and-Hold with Multiplexed Input

Analog Devices 

SMP18

ABSOLUTE MAXIMUM RATINGS

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V

VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V

VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD

VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD

VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD

Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA

(Not short-circuit protected)

Operating Temperature Range

FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C

Package Type

16-Pin Plastic DIP (P)

16-Pin SOIC (S)

16-Lead TSSOP (RU)

␪JA*

␪JC

Units

76

33

°C/W

92

27

°C/W

180

35

°C/W

NOTES

*θJA is specified for worst case mounting conditions, i.e., θJA is specified for device

in socket for plastic DIP packages; θJA is specified for device soldered to printed

circuit board for SOIC and TSSOP packages.

PIN CONNECTIONS

CH4OUT 1

16 VDD

CH6OUT 2

15 CH2OUT

INPUT 3

CH7OUT 4

14 CH1OUT

SMP18

13 CH0OUT

TOP VIEW

CH5OUT 5 (Not to Scale) 12 CH3OUT

INH 6

11 A CONTROL

VSS 7

10 B CONTROL

DGND 8

9 C CONTROL

Model

ORDERING GUIDE

Temperature

Range

Package

Description

SMP18FP

SMP18FRU

SMP18FS

–40°C to +85°C

–40°C to +85°C

–40°C to +85°C

Plastic DIP

TSSOP-16

SO-16

Package

Option

N-16

RU-16

R-16A

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the SMP18 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

REV. C

–3–

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