DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

S29AL004D Просмотр технического описания (PDF) - Spansion Inc.

Номер в каталоге
Компоненты Описание
производитель
S29AL004D Datasheet PDF : 55 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Advance Information
Connection Diagrams
RY/BY# 1
NC 2
A17 3
A7 4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
SO
A0 11
CE# 12
VSS 13
OE# 14
DQ0 15
DQ8 16
DQ1 17
DQ9 18
DQ2 19
DQ10 20
DQ3 21
DQ11 22
44 RESET#
43 WE#
42 A8
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE#
32 VSS
31 DQ15/A-1
30 DQ7
29 DQ14
28 DQ6
27 DQ13
26 DQ5
25 DQ12
24 DQ4
23 VCC
FBGA
Top View, Balls Facing Down
A6
B6
C6
D6
E6
F6
G6
H6
A13
A12
A14
A15
A16 BYTE# DQ15/A-1 VSS
A5
B5
C5
D5
E5
F5
G5
H5
A9
A8
A10
A11
DQ7 DQ14 DQ13 DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE# RESET# NC
NC
DQ5 DQ12 VCC
DQ4
A3
B3
C3
D3
E3
F3
G3
H3
RY/BY# NC
NC
NC
DQ2 DQ10 DQ11 DQ3
A2
B2
C2
A7
A17
A6
D2
E2
F2
G2
H2
A5
DQ0 DQ8 DQ9
DQ1
A1
B1
C1
D1
E1
F1
G1
H1
A3
A4
A2
A1
A0
CE#
OE#
VSS
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.Flash
memory devices in FBGA packages may be damaged if exposed to ultrasonic
cleaning methods. The package and/or data integrity may be compromised if the
package body is exposed to temperatures above 150°C for prolonged periods of
time.
8
S29AL004D
S29AL004D_00_A1 February 18, 2005

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]