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MMSZ4697T3G(2012) Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание
производитель
MMSZ4697T3G
(Rev.:2012)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MMSZ4697T3G Datasheet PDF : 6 Pages
1 2 3 4 5 6
MMSZ4xxxT1G Series,
SZMMSZ4xxxT1G Series
Zener Voltage Regulators
500 mW SOD123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD123 package. These devices provide a
convenient alternative to the leadless 34package style.
Features
500 mW Rating on FR4 or FR5 Board
Wide Zener Reverse Voltage Range 1.8 V to 43 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
PbFree Packages are Available*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V0
MAXIMUM RATINGS
Rating
Symbol Max
Units
Total Power Dissipation on FR5 Board,
PD
(Note 1) @ TL = 75C
500
mW
Derated above 75C
6.7
mW/C
Thermal Resistance, (Note 2)
JunctiontoAmbient
RqJA
C/W
340
Thermal Resistance, (Note 2)
JunctiontoLead
RqJL
C/W
150
Junction and Storage Temperature Range TJ, Tstg 55 to
C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
February, 2012 Rev. 9
http://onsemi.com
SOD123
CASE 425
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
1
xx M G
G
xx = Device Code (Refer to page 3)
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
MMSZ4xxxT1G
SOD123
(PbFree)
SZMMSZ4xxxT1G SOD123
(PbFree)
MMSZ4xxxT3G
SZMMSZ4xxxT3G
SOD123
(PbFree)
SOD123
(PbFree)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
MMSZ4678T1/D

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