MMBFJ175LT1G(2009) Просмотр технического описания (PDF) - ON Semiconductor
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MMBFJ175LT1G Datasheet PDF : 2 Pages
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MMBFJ175LT1G
JFET Chopper
P−Channel − Depletion
Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Drain−Gate Voltage
Reverse Gate−Source Voltage
THERMAL CHARACTERISTICS
Symbol
VDG
VGS(r)
Value
25
−25
Unit
V
V
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
Symbol
PD
Max
225
1.8
Unit
mW
mW/°C
Thermal Resistance, Junction−to−Ambient RqJA
556
°C/W
Junction and Storage Temperature
TJ, Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Gate −Source Breakdown Voltage
(VDS = 0, ID = 1.0 mA)
V(BR)GSS 30
−
V
Gate Reverse Current
(VDS = 0 V, VGS = 20 V)
IGSS
− 1.0 nA
Gate −Source Cutoff Voltage
(VDS = 15, ID = 10 nA)
VGS(OFF) 3.0 6.0
V
ON CHARACTERISTICS
Zero Gate−Voltage Drain Current (Note 2) IDSS 7.0 60 mA
(VGS = 0, VDS = 15 V)
Drain Cutoff Current
(VDS = 15 V, VGS = 10 V)
ID(off)
− 1.0 nA
Drain Source On Resistance
(ID = 500 mA)
rDS(on)
− 125
W
Input Capacitance
Ciss
Reverse Transfer
VDS = 0, VGS = 10V
f = 1.0 MHz
Crss
Capacitance
− 11
− 5.5 pF
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
http://onsemi.com
2 SOURCE
3
GATE
1 DRAIN
3
1
2
SOT−23 (TO−236)
CASE 318
STYLE 10
MARKING DIAGRAM
6W M G
G
1
6W = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
MMBFJ175LT1G SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 − Rev. 5
Publication Order Number:
MMBFJ175LT1/D
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