MJD210T4 Просмотр технического описания (PDF) - ON Semiconductor
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MJD210T4 Datasheet PDF : 6 Pages
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MJD200 (NPN)
MJD210 (PNP)
Complementary Plastic
Power Transistors
NPN/PNP Silicon DPAK For Surface
Mount Applications
Designed for low voltage, low−power, high−gain audio
amplifier applications.
Features
• Collector−Emitter Sustaining Voltage −
VCEO(sus) = 25 Vdc (Min) @ IC = 10 mAdc
• High DC Current Gain − hFE = 70 (Min) @ IC = 500 mAdc
= 45 (Min) @ IC = 2 Adc
= 10 (Min) @ IC = 5 Adc
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Low Collector−Emitter Saturation Voltage −
VCE(sat) = 0.3 Vdc (Max) @ IC = 500 mAdc
= 0.75 Vdc (Max) @ IC = 2.0 Adc
• High Current−Gain − Bandwidth Product −
fT = 65 MHz (Min) @ IC = 100 mAdc
• Annular Construction for Low Leakage −
ICBO = 100 nAdc @ Rated VCB
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• Pb−Free Packages are Available
MAXIMUM RATINGS
Rating
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
Collector Current − Continuous
− Peak
Symbol
VCB
VCEO
VEB
IC
Max
40
25
8.0
5.0
10
Unit
Vdc
Vdc
Vdc
Adc
Base Current
Total Power Dissipation @ TC = 25°C
Derate above 25°C
IB
1.0
Adc
PD
12.5
W
0.1
W/°C
Total Power Dissipation (Note 1)
@ TA = 25°C
Derate above 25°C
PD
1.4
W
0.011
W/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
http://onsemi.com
SILICON
POWER TRANSISTORS
5 AMPERES
25 VOLTS, 12.5 WATTS
4
12
3
DPAK
CASE 369C
STYLE 1
MARKING DIAGRAM
YWW
J2x0G
Y = Year
WW = Work Week
x = 1 or 0
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
August, 2006 − Rev. 8
Publication Order Number:
MJD200/D
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