MC12079P Просмотр технического описания (PDF) - LANSDALE Semiconductor Inc.
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MC12079P Datasheet PDF : 4 Pages
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ML12079
LANSDALE Semiconductor, Inc.
NOTE 2
–T–
SEATING
PLANE
H
8
5
1
4
F
–A–
–B–
OUTLINE DIMENSIONS
P DIP 8 = PP
PLASTIC PACKAGE
(ML12079PP)
CASE 626–05
ISSUE K
L
C
J
N
D
K
M
G
0.13 (0.005) M T A M B M
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G
2.54 BSC
0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L
7.62 BSC
0.300 BSC
M ––– 10
––– 10
N 0.76 1.01 0.030 0.040
A
D
SO 8 = -5P
PLASTIC PACKAGE
(ML12079-5P)
CASE 751–06
ISSUE T
C
8
E
1
5
H
4
0.25 M B M
B
e
h X 45
C
A
SEATING
PLANE
L
0.10
A1
B
0.25 M C B S A S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E 3.80 4.00
e
1.27 BSC
H 5.80 6.20
h 0.25 0.50
L 0.40 1.25
0
7
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
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