MBRF2545CT Просмотр технического описания (PDF) - ON Semiconductor
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MBRF2545CT Datasheet PDF : 4 Pages
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MBRF2545CT
TEST CONDITIONS FOR ISOLATION TEST*
FULLY ISOLATED PACKAGE
LEADS
HEATSINK
0.110, MIN
Figure 3. Mounting Position
* Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION
CLIP
HEATSINK
Clip-Mounted
Figure 4. Typical Mounting Technique
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