MBA02040C8201FRP00 Просмотр технического описания (PDF) - Vishay Semiconductors
Номер в каталоге
Компоненты Описание
производитель
MBA02040C8201FRP00 Datasheet PDF : 15 Pages
| |||
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional
www.vishay.com
Vishay Beyschlag
TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• EN 60115-1, generic specification (includes tests)
• EN 140100, sectional specification (includes schedule for
qualification approval)
• EN 140101-806 (successor of CECC 40101-806), detail
specification (includes schedule for conformance
inspection)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3.
Climatic category LCT / UCT / 56 (rated temperature range:
lower category temperature, upper category temperature;
damp heat, steady state, test duration: 56 days) is valid.
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31.
In Test Procedures and Requirements table, only the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
Stability for product types:
MBA/SMA 0204
MBB/SMA 0207
REQUIREMENTS PERMISSIBLE CHANGE
(ΔR max.)
STABILITY
CLASS 0.5
STABILITY
CLASS 1
STABILITY
CLASS 2
1 Ω to 332 kΩ
0.22 Ω to < 1 Ω
> 332 kΩ
1 Ω to 1 MΩ
0.22 Ω to < 1 Ω
> 1 MΩ
4.5
4.7
4.8
4.13
4.16
4.17
4.18.2
4.19
4.22
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
-
-
-
21 (Ua1)
21 (Ub)
21 (Uc)
20 (Ta)
20 (Tb)
14 (Na)
6
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
Resistance
Voltage proof
Temperature
coefficient
Short time
overload
Robustness
of terminations
MBE/SMA 0414
-
URMS = Uins; 60 s
At (20 / -55 / 20) °C
and (20 / 155 / 20) °C
Room temperature;
U = 2.5 x P70 x R or
U = 2 x Umax.; 5 s
Tensile, bending,
and torsion
1 Ω to 2.4 MΩ
0.22 Ω to < 1 Ω
± 5 % R; ± 1 % R; ± 0.5 % R
No flashover or breakdown
± 50 ppm/K; ± 25 ppm/K
> 2.4 MΩ
± (0.1 % R + 0.01 Ω) ± (0.25 % R + 0.05 Ω)
± 0.5 % R
no visible damage no visible damage no visible damage
± (0.1 % R + 0.01 Ω) ± (0.25 % R + 0.05 Ω)
± 0.5 % R
+235 °C; 2 s; solder bath
Solderability
method; SnPb40
+245 °C; 3 s; solder bath
Good tinning
(> 95 % covered, no visible damage)
method; SnAg3Cu0.5
Resistance to Unmounted components; ± (0.1 % R + 0.01 Ω) ± (0.25 % R + 0.05 Ω)
± 0.5 % R
soldering heat
(260 ± 5) °C; (10 ± 1) s
no visible damage no visible damage no visible damage
30 min at -55 °C
30 min at 155 °C
Rapid change
of temperature
5 cycles
MBA/SMA 0204: 500 cycles
MBB/SMA 0207: 200 cycles
MBE/SMA 0414: 100 cycles
± (0.1 % R + 0.01 Ω) ± (0.25 % R + 0.05 Ω)
± 0.5 % R
± (0.5 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
10 sweep cycles per
Vibration
direction; 10 Hz to 2000 Hz ± (0.1 % R + 0.01 Ω) ± (0.25 % R + 0.05 Ω)
1.5 mm or 200 m/s2
± 0.5 % R
Climatic
sequence:
Dry heat
155 °C; 16 h
Damp heat,
55 °C; 24 h;
cyclic
≥ 90 % to 100 % RH; 1 cycle
Cold
-55 °C; 2 h
Low air
8.5 kPa; 2 h;
pressure
15 °C to 35 °C
Damp heat,
55 °C; 5 days;
± (0.5 % R + 0.05 Ω) ± (1 % R + 0.05 Ω)
cyclic
≥ 95 % to 100 % RH; 5 cycles no visible damage no visible damage
±2%R
no visible damage
DC load
apply rated power for 1 min
Revision: 02-Nov-15
11
Document Number: 28766
For technical questions, contact: filmresistorsleaded@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Share Link: 