MAX5316 Просмотр технического описания (PDF) - Maxim Integrated
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MAX5316 Datasheet PDF : 33 Pages
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MAX5316
16-Bit, ±1 LSB Accuracy Voltage Output
DAC with SPI Interface
ABSOLUTE MAXIMUM RATINGS
AGND to DGND....................................................-0.3V to +0.3V
AGND_F, AGND_S to AGND................................-0.3V to +0.3V
AGND_F, AGND_S to DGND................................-0.3V to +0.3V
AVDD_ to AGND......................................................-0.3V to +6V
AVDD_ to REF..........................................................-0.3V to +6V
AVSS to AGND.........................................................-2V to +0.3V
VDDIO to DGND........................................................-0.3V to +6V
BYPASS to DGND........................................-0.3V to the lower of
(VAVDD_ or VDDIO + 0.3V) and +6V
OUT, REFO, RFB to AGND..........................-0.3V to the lower of
(VAVDD_ + 0.3V) and +6V
REF to AGND...............................................-0.3V to the lower of
SCLK, DIN, CS, BUSY, LDAC, READY,
VAVDD and +6V
M/Z, TC/SB, RST, PD, DOUT to DGND........-0.3V to the lower of
(VDDIO + 0.3V) and +6V
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 28.6mW/NC above +70NC)................2285.7mW
Operating Temperature Range......................... -40NC to +105NC
Maximum Junction Temperature......................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Case Thermal Resistance (qJA)...............1.8°C/W
Junction-to-Ambient Thermal Resistance (qJA)...........35°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VAVDD_ = VDDIO = 4.5V to 5.5V, VAVSS = -1.25V, VAGND = VDGND = VAGND_F = VAGND_S = 0V, VREF = 4.096V, TC/SB = PD = LDAC
= M/Z = DGND, RST = VDDIO, CREFO = 100pF, CL = 100pF, RL = 10kω, CBYPASS = 1µF, TA = -40°C to +105°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER
STATIC PERFORMANCE
Resolution
Integral Nonlinearity (Note 3)
Differential Nonlinearity (Note 3)
Zero Code Error
Zero Code Error Drift
Gain Error
Gain Error Temperature
Coefficient
SYMBOL
CONDITIONS
N
INL
DNL
OE
GE
TCGE
DIN = 0x0000 to 0xFFFF (binary
mode), DIN = 0x8000 to 0x7FFF (two’s
complement mode)
DIN = 0x0640 to 0xFFFF (binary
mode), DIN = 0x8280 to 0x7FFF (two’s
complement mode), VAVSS = 0V
DIN = 0, TA = +25NC
DIN = 0, TA = -40NC to +105NC
DIN = 0
TA = +25NC
TA = -40NC to +105NC
MIN
TYP MAX UNITS
16
Bits
-1
Q0.25 +1
LSB
-1
-19
-2.5
-4
-2.75
Q0.25
Q1
Q6
Q0.4
Q0.25
Q3
Q0.6
+1
LSB
+19
LSB
+2.5
+4
ppm/NC
LSB
+2.75
ppm/NC
of FSR
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