LM2931 Просмотр технического описания (PDF) - Motorola => Freescale
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LM2931 Datasheet PDF : 16 Pages
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LM2931 Series
Figure 23. SOP–8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
170
3.2
150
PD(max) for TA = 50°C
2.8
130
2.4
110
90
70
Graph represents symmetrical layout 2.0
ÎÎÎÎÎÎÎÎÎÎÎÎÎ L
2.0 oz.
Copper
ÎÎÎ ÎÎÎ L
1.6
1.2
3.0 mm
50
0.8
RθJA
30
0.4
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 24. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
2.4
Free Air
90
Mounted
PD(max) for TA = 50°C
2.0
Vertically
80
Minimum
70
Size Pad
60
2.0 oz. Copper
L
1.6
ÎÎÎÎ L
1.2
ÎÎÎÎÎÎÎÎ 0.8
50
0.4
RθJA
40
0
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 25. 3–Pin and 5–Pin D2PAK
Thermal Resistance and Maximum Power
Dissipation versus P.C.B. Copper Length
80
3.5
PD(max) for TA = 50°C
70
Free Air
3.0
Mounted
Vertically
60
Minimum
50
Size Pad
40
2.0 oz. Copper
L
2.5
ÎÎÎÎÎÎÎÎ L
2.0
ÎÎÎÎÎÎÎÎ 1.5
RθJA
30
1.0
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
MOTOROLA ANALOG IC DEVICE DATA
9
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