HSMX-C177 Просмотр технического описания (PDF) - HP => Agilent Technologies
Номер в каталоге
Компоненты Описание
производитель
HSMX-C177 Datasheet PDF : 13 Pages
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10
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.
10 SEC. MAX.
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
Figure 9. Recommended Reflow Soldering Profile.
217 °C
255 °C (+5/-0)
3 °C/SEC. MAX.
100 - 150 °C
MAX. 120 SEC.
10 to 20 SEC.
6 °C/SEC. MAX.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 10. Recommended Pb-Free Reflow Soldering Profile.
1.5 (0.059)
1.2 (0.047)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 11. Recommended Soldering
Pattern for HSMx-C150.
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 12. Recommended Soldering
Pattern for HSMx-C170 and C177.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 13. Recommended Soldering
Pattern for HSMx-C190, C191 and C197.
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