CMM0014-BD(2005) Просмотр технического описания (PDF) - Mimix Broadband
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CMM0014-BD Datasheet PDF : 4 Pages
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CMM0014-BD
2.0 to 22.0 GHz
GaAs MMIC
Power Amplifier
Chip Diagram
Advanced Product Information
August 2004
(1 of 3)
Features
❏ Small Size: 45 x 92 mils
❏ High Gain: 11.5 dB, Nom
❏ Medium Power: +25 dBm, Typ P1dB @14 GHz
❏ Directly Cascadable – Fully Matched
❏ Unconditionally Stable
❏ Single Bias Operation
❏ Bias Control
❏ pHEMT Technology
❏ Silicon Nitride Passivation
Specifications (TA = 25°C, Vdd = 8V)1
Parameters
Frequency Range
Small Signal Gain
Gain Flatness
Gain Variation (-40°C to +85°C)
Input Return Loss
Output Return Loss
Power Output (@1 dB Gain Compression) 1
P1dB Variation (over operating frequency)
P1dB Variation (-40°C to +85°C)
Saturated Output Power
Second Order Intercept Point @ 10 GHz
Third Order Intercept Point @ 10 GHz
Noise Figure
Current
Thermal Resistance
Stability 2
Units
GHz
dB
±dB
±dB
dB
dB
dBm
dBm
±dBm
dBm
dBm
dBm
dB
mA
°C/W
Min
2.0
10.0
22.5
24.0
250
Unconditionally Stable
Typ
-10.0
-9.0
48.0
37.5
295
Max
22.0
13.5
0.8
0.35
4.5
0.25
29.0
7.5
340
33.0
Notes: 1. Tested on Celeritek Connectorized evaluation board (standard assembly condition detailed on page 3).
2. Stability factor measured on-wafer.
Absolute Maximum Ratings
Parameter
Drain Voltage
Drain Current
Continuous Power Dissipation
Input Power
Storage Temperature
Channel Temperature
Operating Backside Temperature
Rating
7V (min.) / 9V (max.)
350 mA
2.8 W
+20 dBm
-50°C to +150°C
+175°C
-40 to (see note 2)°C
Notes: 1. Operation outside these limits can cause permanent damage.
2. Calculation maximum operating temperature:
Tmax = 175–(Pdis [W] x 33.0) [°C].
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
3236 Scott Boulevard
Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
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