0603YC104KAT2A Просмотр технического описания (PDF) - Microchip Technology
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0603YC104KAT2A Datasheet PDF : 26 Pages
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MCP2210 BREAKOUT MODULE
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 MCP2210 Breakout Module General Description .......................................... 9
1.3 What the MCP2210 Breakout Module Kit Includes ........................................ 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2210 Typical Usage Scenarios ............................................................. 14
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 17
A.2 Board – Schematic ....................................................................................... 18
A.3 Board – Top Silk and Pads .......................................................................... 19
A.4 Board – Top Silk, Pads and Copper ............................................................ 20
A.5 Board – Top Pads and Copper .................................................................... 21
A.6 Board – Bottom Silk and Pads ..................................................................... 22
A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23
A.8 Board – Bottom Pads and Copper ............................................................... 24
Appendix B. Bill of Materials
Worldwide Sales and Service .................................................................................... 26
© 2012 Microchip Technology Inc.
DS52056A-page 3
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