BSS138BKW Просмотр технического описания (PDF) - Philips Electronics
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BSS138BKW Datasheet PDF : 16 Pages
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NXP Semiconductors
9. Package outline
Plastic surface-mounted package; 3 leads
D
B
BSS138BKW
60 V, 320 mA N-channel Trench MOSFET
SOT323
E
A
X
y
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25 2.2
0.10 1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
OUTLINE
VERSION
IEC
SOT323
REFERENCES
JEDEC
JEITA
SC-70
Fig 18. Package outline SOT323 (SC-70)
BSS138BKW
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2011
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
© NXP B.V. 2011. All rights reserved.
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