AD9040 Просмотр технического описания (PDF) - Analog Devices
Номер в каталоге
Компоненты Описание
производитель
AD9040 Datasheet PDF : 12 Pages
| |||
AD9040A
N
AIN
N+1
ENCODE
DIGITAL
OUTPUTS
tA
#2
tEH tEL
tPD
N–3
N–2
#3
N–1
MIN
tA APERTURE DELAY
tEH PULSEWIDTH HIGH
10
tEL PULSEWIDTH LOW
10
tPD OUTPUT PROP DELAY 7.5
TYP
1.9
10ns
MAX
100
100
12
Figure 1. Timing Diagram
PIN FUNCTION DESCRIPTIONS
Pin No.
Name Function
1, 12, 21
2, 4, 11, 14, 22
3, 10
5
6
7
8
9
13
15
16
17–20
23
24–27
28
–VS
GND
5 V Power Supply
Ground
+VS
VOUT
Analog +5 V Power Supply
Internal Bandgap Voltage
Reference (Nominally +2.5 V)
VREF
Noninverting Input to Reference
Amplifier. Voltage reference for
ADC is connected here.
BPREF
External Connection for (0.1 µF)
Reference Bypass Capacitor
NC
No Connection Internally
ENCODE Encode Clock Input to ADC.
Internal T/H placed in hold mode
(ADC is encoding) on rising edge.
AIN
Noninverting Input to T/H
Amplifier
OR
Out-of-Range Condition Output.
Active high when analog input
exceeds input range of ADC by
1 LSB (<FS –1 LSB or >+FS
+ 1 LSB).
D9 (MSB) Most Significant Bit of ADC
Output; TTL/CMOS Compatible
D8–D5 Digital Output Bits of ADC; TTL/
CMOS Compatible
VD
D4–D1
D0 (LSB)
Digital +5 V Power Supply
Digital Output Bits of ADC;
TTL/CMOSL Compatible
Least Significant Bit of ADC
Output; TTL/CMOS Compatible
–VS 1
GND 2
28 D0 (LSB)
27 D1
+VS 3
26 D2
GND 4
25 D3
VOUT 5
24 D4
VREF 6 AD9040A 23 VD
BPREF 7 TOP VIEW 22 GND
NC 8 (Not to Scale) 21 –VS
ENCODE 9
20 D5
+VS 10
19 D6
GND 11
18 D7
–VS 12
17 D8
AIN 13
16 D9 (MSB)
GND 14
15 OR
NC = NO CONNECT
PDIP and SOIC Pinouts
D7
D6
D5
–VS
DGND
VD
D4
D3
D2
+VS
ENCODE
NC
BPREF
VREF
VOUT
GND
DIE LAYOUT AND MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . . 204 × 185 × 21 (± 1) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–VS
Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5,070
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach (JN/JR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Epoxy
Bond Wire (JN/JR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
–4–
REV. B
Share Link: 