FXLP34 Просмотр технического описания (PDF) - Fairchild Semiconductor
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Компоненты Описание
производитель
FXLP34 Datasheet PDF : 12 Pages
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Physical Dimensions
0.05 C
2X
PIN 1
MIN 250uM
1.00
BA
1.00
5X 0.40
1X 0.45
0.89
0.35
0.66
TOP VIEW
0.05 C
2X
0.05 C
6X 0.19
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
0.90
0.35
C
0.55MAX
5X 0.52
SIDE VIEW
0.73
(0.08) 4X
DETAIL A
123
0.09
0.19 6X
1X 0.57
0.20 6X
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
(0.05) 6X
5X 0.35
0.25
0.35
65 4
BOTTOM VIEW
0.60
(0.08)
4X
0.10
.05 C
NOTES:
A. COMPLIES TO JEDEC MO-252 STANDARD
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
DESIGN.
E. DRAWING FILENAME AND REVISION: MGF06AREV3
CBA
0.075X45°
CHAMFER
0.40
0.30
DETAIL A
PIN 1 LEAD SCALE: 2X
Figure 7. 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specification
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator
FHX
Tape Section
Leader (Start End)
Carrier
Trailer (Hub End)
Cavity Number
125 (Typical)
5000
75 (Typical)
Cavity Status Cover Type Status
Empty
Sealed
Filled
Sealed
Empty
Sealed
© 2006 Fairchild Semiconductor Corporation
FXLP34 • Rev. 1.0.4
11
www.fairchildsemi.com
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