LTC4440IMS8E Просмотр технического описания (PDF) - Linear Technology

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LTC4440IMS8E

High Speed, High Voltage High Side Gate Driver

Linear Technology 

LTC4440

PI FU CTIO S

Exposed Pad MS8E Package

INP (Pin 1): Input Signal. TTL/CMOS compatible input

referenced to GND (Pin 2).

GND (Pins 2, 4): Chip Ground.

VCC (Pin 3): Chip Supply. This pin powers the internal low

side circuitry. A low ESR ceramic bypass capacitor should

be tied between this pin and the GND pin (Pin 2).

NC (Pin 5): No Connect. No connection required. For

convenience, this pin may be tied to Pin 6 (BOOST) on the

application board.

BOOST (Pin 6): High Side Bootstrapped Supply. An exter-

nal capacitor should be tied between this pin and TS

(Pin 8). Normally, a bootstrap diode is connected between

VCC (Pin 3) and this pin. Voltage swing at this pin is from

VCC – VD to VIN + VCC – VD, where VD is the forward voltage

drop of the bootstrap diode.

TG (Pin 7): High Current Gate Driver Output (Top Gate).

This pin swings between TS and BOOST.

TS (Pin 8): Top (High Side) Source Connection.

Exposed Pad (Pin 9): Ground. Must be electrically con-

nected to Pins 2 and 4 and soldered to PCB ground for

optimum thermal performance.

BLOCK DIAGRA

8V TO 15V

VCC UNDERVOLTAGE

LOCKOUT

GND

INP

HIGH SIDE

UNDERVOLTAGE

LOCKOUT

BOOST

LEVEL SHIFTER

GND

TS

BOOST

TG

TS

WU

W

TI I G DIAGRA

INPUT (INP)

OUTPUT (TG)

INPUT RISE/FALL TIME < 10ns

VIH

VIL

tr

tPLH

tf

tPHL

90%

10%

4440 TD

6

VIN

UP TO 80V,

TRANSIENT

UP TO 100V

4440 BD

4440f

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