STTH3R02(2006) Просмотр технического описания (PDF) - STMicroelectronics
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STTH3R02 Datasheet PDF : 9 Pages
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STTH3R02
Ordering information scheme
Figure 11. Dynamic parameters versus
junction temperature
QRR; IRM [Tj] / QRR; IRM [Tj=125°C]
1.4
IF=3A
1.2
VR=160V
1.0
0.8
IRM
0.6
QRR
0.4
0.2
0.0
25
50
75
100
Tj(°C)
125
150
Figure 12.
Thermal resistance junction to
ambient versus copper surface
under each lead for DO-15 and
DO-201AD (Epoxy printed circuit
board FR4, eCU = 35µm)
Rth(j-a) (°C/W)
100
90
80
70
DO-15
60
50
DO-201AD
40
30
20
10
SCu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 13.
Thermal resistance versus copper
surface under each lead for SMC
(Epoxy printed circuit board FR4,
eCU = 35µm)
Figure 14. Thermal resistance versus lead
length for DO-201AD package
Rth(j-a) (°C/W)
100
SMC
80
60
40
20
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(°C/W)
100
90
80
70
60
50
40
30
20
10
0
5
10
Rth(j-a)
Rth(j-l)
15
DO-201AD
Lleads(mm)
20
25
2
Ordering information scheme
STTH 3 R 02 XXX
Ultrafast switching diode
Average forward current
3=3A
Model R
Repetitive peak reverse voltage
02 = 200 V
Package
Blank = DO-201 in Ammopack
RL = DO-201 in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
S= SMC in Tape and reel
5/9
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