MCS04020D2213BE100 Просмотр технического описания (PDF) - Vishay Semiconductors
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MCS04020D2213BE100 Datasheet PDF : 12 Pages
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MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com
Vishay Beyschlag
DIMENSIONS
Tt
W WT
H
Tb
L
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
MCS 0402
0.32 ± 0.05
1.0 ± 0.05
MCT 0603 0.45 + 0.1 / - 0.05 1.55 ± 0.05
MCU 0805 0.45 + 0.1 / - 0.05 2.0 ± 0.1
MCA 1206
0.55 ± 0.1 3.2 + 0.1 / - 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
WT
(mm)
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
Tt
(mm)
Tb
(mm)
0.2 + 0.1 / - 0.15 0.2 ± 0.1
0.3 + 0.15 / - 0.2 0.3 + 0.15 / - 0.2
0.4 + 0.1 / - 0.2 0.4 + 0.1 / - 0.2
0.5 ± 0.25
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
G
X
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
G
(mm)
WAVE SOLDERING
Y
(mm)
X
(mm)
MCS 0402
-
-
-
MCT 0603
0.55
1.10
1.10
MCU 0805
0.80
1.25
1.50
MCA 1206
1.40
1.50
1.90
Z
(mm)
-
2.75
3.30
4.40
G
(mm)
0.35
0.65
0.90
1.50
REFLOW SOLDERING
Y
(mm)
X
(mm)
0.55
0.55
0.70
0.95
0.90
1.40
1.15
1.75
Z
(mm)
1.45
2.05
2.70
3.80
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351.
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
Revision: 16-Aug-16
9
Document Number: 28700
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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