MCS04020D2002BE100 Просмотр технического описания (PDF) - Vishay Semiconductors

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производитель

MCS04020D2002BE100

Precision Thin Film Chip Resistors

Vishay Semiconductors 

MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision

www.vishay.com

Vishay Beyschlag

TEST PROCEDURES AND REQUIREMENTS

EN

60 115-1

CLAUSE

IEC

60 068-2 (1)

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

STABILITY CLASS 0.1

STABILITY CLASS 0.25

Stability for product types:

MCS 0402

100  to 10 k

> 10 kto 221 k

MCT 0603

100  to 10 k

39  to < 100 ;

> 10 k to 511 k

MCU 0805

100  to 47.5 k

39  to < 100 ;

> 47.5 k to 1.5 M

MCA 1206

47  to 332 k

39  to < 47 ;

> 332 k to 2 M

IEC 61340-3-1 (1);

3 pos. + 3 neg.

Electro static (equivalent to MIL-STD-883,

4.38

-

discharge

(human body

method 3015)

MCS 0402: 500 V

model)

MCT 0603: 1000 V

MCU 0805: 1500 V

MCA 1206: 2000 V

±(0.5 % R + 0.05 )

Endurance by sweeping;

10 Hz to 2000 Hz;

4.22

6 (Fc)

Vibration

no resonance; amplitude

1.5 mm or  200 m/s2;

7.5 h

± (0.05 % R + 0.01 )

no visible damage

Solder bath method;

SnPb40; non-activated flux;

(215 ± 3) °C; (3 ± 0.3) s

4.17

58 (Td)

Solderability

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Good tinning ( 95 % covered);

no visible damage

Good tinning ( 95 % covered);

no visible damage

4.18

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

±(0.05 % R + 0.01 )

4.29

45 (XA)

Component

solvent

resistance

Isopropyl alcohol; + 50 °C;

method 2

No visible damage

MCS 0402 and MCT 0603;

4.32

21 (Ue3)

Shear

(adhesion)

9N

MCU 0805 and MCA 1206;

45 N

No visible damage

No visible damage

4.33

21 (Ue1)

Substrate

bending

Depth 2 mm, 3 times

±(0.05 % R + 0.01 )

no visible damage, no open circuit in bent position

4.7

4.35

-

Voltage proof

URMS = Uins; (60 ± 5) s

-

Flammability

IEC 60695-11-5 (1),

needle flame test; 10 s

No flashover or breakdown

No burning after 30 s

Note

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.

Revision: 16-Aug-16

8

Document Number: 28700

For technical questions, contact: thinfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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