ZXMD65P03N8
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).
PARAMETER
SYMBOL MIN.
TYP.
MAX. UNI CONDITIONS.
T
STATIC
Drain-Source Breakdown Voltage
V(BR)DSS -30
Zero Gate Voltage Drain Current
IDSS
Gate-Body Leakage
IGSS
Gate-Source Threshold Voltage
VGS(th)
-1.0
Static Drain-Source On-State Resistance RDS(on)
(1)
Forward Transconductance (1)(3)
gfs
DYNAMIC (3)
V ID=-250µA, VGS=0V
-1
µA VDS=-24V, VGS=0V
-100
nA VGS=±12V, VDS=0V
V
I =-250µA,
D
VDS=
VGS
0.055 Ω VGS=-10V, ID=-4.9A
0.080 Ω VGS=-4.5V, ID=-3.6A
8.8
S VDS=-15V,ID=-4.9A
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
SWITCHING(2) (3)
930
pF
VDS=-25 V, VGS=0V,
311
pF f=1MHz
113
pF
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate Charge
td(on)
tr
td(off)
tf
Qg
3.8
6.4
49.5
26.2
13
ns
ns VDD =-15V, ID=-4.9A
ns RG=6.0Ω, VGS=-10V
ns
nC VDS=-15V,VGS=-5V
ID=-4.9A
Total Gate Charge
Gate-Source Charge
Gate Drain Charge
SOURCE-DRAIN DIODE
Qg
25.7
Qgs
3.2
Qgd
7.0
Diode Forward Voltage (1)
VSD
0.95
Reverse Recovery Time (3)
trr
31.5
Reverse Recovery Charge(3)
Qrr
63.9
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
nC
VDS=-15V,VGS=-10V
nC ID=-4.9A
nC
V Tj=25°C, IS=-4.9A,
VGS=0V
ns Tj=25°C, IF=-4.9A,
di/dt= 100A/µs
nC
PROVISIONAL ISSUE A - MAY 2001