XP1001 Просмотр технического описания (PDF) - Mimix Broadband
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XP1001 Datasheet PDF : 6 Pages
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26.0-40.0 GHz GaAs MMIC
Power Amplifier
May 2005 - Rev 05-May-05
Mechanical Drawing
0.516 0.914 1.313
(0.020) (0.036) (0.052)
2.500
(0.098)
2
3
4
1.915
(0.075)
5
P1001
6
1.910
(0.075)
0.945
(0.037)
1
0.0
0.0
13
12
11
0.516 0.914 1.313
(0.020) (0.036) (0.052)
10
1.915
(0.075)
9 87
3.012 3.414
(0.119) (0.134)
3.213 3.540
(0.127) (0.139)
(Note: Engineering designator is 38PAMP_07B)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.482 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1)
Bias Arrangement
Vg1,2
2
3
4
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #6 (RF Out)
Vd1,2
5
Bond Pad #7 (V2 Out)
Bond Pad #8 (Vd5)
Bond Pad #9 (V1 Out)
Bond Pad #10 (Vd4)
Bond Pad #11 (Vg4)
Bond Pad #12 (Vd3)
Bond Pad #13 (Vg3)
Bypass Capacitors - See App Note [3]
Vg1,2
Vd1,2
6 RF Out
RF In 1
Vg3,4
13
12
11
10
987
Vd3,4
V2 Out
Rd
Vd5
V1 Out
RF In
XP1001
RF Out
V2 Out
Vd5
Vg3,4 Vd3,4 V1 Out
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. ©2004 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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