108130469 Просмотр технического описания (PDF) - Agere -> LSI Corporation
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108130469
Agere -> LSI Corporation
108130469 Datasheet PDF : 8 Pages
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D372-Type Digital Uncooled DFB
Laser Module for 2.5 Gbits/s Applications
Data Sheet
December 2000
Description (continued)
The device characteristics listed in this document are
met at 2.0 mW output power. Higher- or lower-power
operation is possible. Under conditions of a fixed
photodiode current, the change in optical output is typi-
cally ±0.5 dB over an operating temperature range of
–40 °C to +85 °C.
This device incorporates the new laser 2000 manufac-
turing process from the Optoelectronic Products unit of
Agere Systems Inc.. Laser 2000 is a low-cost platform
that targets high-volume manufacturing and tighter
product distributions on all optical subassemblies. This
platform incorporates an advanced optical design that
is produced on one of the highly automated production
lines at the Opotelectronic manufacturing facility. The
laser 2000 platform is qualified for the central office and
uncontrolled environments, and can be used for appli-
cations requiring high performance and low cost.
Table 1. Pin Descriptions
Pin Number
1
2
3
4
5
6
7
8
Connection
Thermistor
Thermistor, package GND
Laser dc bias cathode (–) choke
Photodiode cathode
Photodiode anode
Laser diode anode (+)
Laser RF input cathode (–) 25 Ω
Laser diode anode (+)
4
3
2
1
5
6
7
8
Figure 1. D372-Type Digital Uncooled DFB Mini 8-Pin Laser Module Schematic, Top View
1-900.b
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Maximum Peak Laser Drive Current or
Maximum Fiber Power*
Peak Reverse Laser Voltage:
Laser
Monitor
Monitor Forward Current
Operating Case Temperature Range
Storage Case Temperature Range
Lead Soldering Temperature/Time
Relative Humidity (noncondensing)
* Rating varies with temperature.
Symbol
Min
IOP
—
PMAX
—
VRL
—
VRD
—
IFD
—
TC
–40
Tstg
–40
—
—
RH
—
Max
150
10
2
20
2
85
85
260/10
85
Unit
mA
mW
V
V
mA
°C
°C
°C/s
%
2
Agere Systems Inc.
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