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TDA7535 Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
TDA7535
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA7535 Datasheet PDF : 12 Pages
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Package information
5
Package information
TDA7535
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 8. SO14 mechanical data and package dimensions
Obsolete
mm
inch
DIM.
OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.35
1.75 0.053
0.069
t(s) A1 0.10
0.30 0.004
0.012
A2 1.10
1.65 0.043
0.065
uc B 0.33
0.51 0.013
0.020
d C 0.19
0.25 0.007
0.01
ro D (1) 8.55
8.75 0.337
0.344
P E 3.80
4.0 0.150
0.157
te e
1.27
0.050
le H
5.8
6.20 0.228
0.244
so h 0.25
0.50 0.01
0.02
b L 0.40
1.27 0.016
0.050
- O k
0˚ (min.), 8˚ (max.)
) ddd
0.10
0.004
t(s (1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
Produc 0.15mm per side.
MECHANICAL DATA
SO14
10/12
0016019 D

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