Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits
English
한국어
日本語
русский
简体中文
español
Номер в каталоге
Компоненты Описание
WED3C7410E16M-XBX Просмотр технического описания (PDF) - White Electronic Designs Corporation
Номер в каталоге
Компоненты Описание
производитель
WED3C7410E16M-XBX
RISC Microprocessor Multichip Package
White Electronic Designs Corporation
WED3C7410E16M-XBX Datasheet PDF : 13 Pages
1
2
3
4
5
6
7
8
9
10
Next
Last
White Electronic Designs
WED3C7410E16M-XBX
FIGURE 5 – PIN ASSIGNMENTS
Ball assignments of the 255 CBGA package as viewed from the top surface.
Side profile of the CBGA package to indicate the direction of the top surface view.
May 2006
Rev. 9
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
Share Link:
datasheetq.com [
Privacy Policy
]
[
Request Datasheet
] [
Contact Us
]