WED3C7410E16M400BHI Просмотр технического описания (PDF) - White Electronic Designs Corporation

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WED3C7410E16M400BHI

7410E RISC Microprocessor HiTCE™ Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBHX

PRELIMINARY

FIGURE 5 – PIN ASSIGNMENTS

Ball assignments of the 255 CBGA package as viewed from the top surface.

Side profile of the CBGA package to indicate the direction of the top surface view.

July 2004

Rev. 0

4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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