Q16DWUUIG Просмотр технического описания (PDF) - Winbond

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Компоненты Описание

производитель

Q16DWUUIG

1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q16DW

3.4 Ball Configuration WLCSP

Top View

A1

A2

VCC

/CS

B1

B2

/HOLD(IO3) DO(IO1)

C1

C2

CLK /WP(IO2)

D1

DI(IO0)

D2

GND

Bottom View

A2

A1

/CS

VCC

B2

B1

DO(IO1) /HOLD(IO3)

C2

C1

/WP(IO2) CLK

D2

GND

D1

DI(IO0)

Figure 1c. W25Q16DW Ball Assignments, 8-ball WLCSP (Package Code BY)

3.5 Ball Description WLCSP

BALL NO.

A1

A2

B1

B2

C1

C2

D1

D2

PIN NAME

VCC

/CS

/HOLD (IO3)

DO (IO1)

CLK

/WP (IO2)

DI (IO0)

GND

I/O

FUNCTION

Power Supply

I

Chip Select Input

I/O

Hold Input (Data Input Output 3)*2

I/O

Data Output (Data Input Output 1)*1

I

Serial Clock Input

I/O

Write Protect Input (Data Input Output 2)*2

I/O

Data Input (Data Input Output 0)*1

Ground

*1 IO0 and IO1 are used for Standard and Dual SPI instructions

*2 IO0 – IO3 are used for Quad SPI instructions

Publication Release Date: September 1, 2014

-7-

Revision J

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