Q16DWUUIP(2012) Просмотр технического описания (PDF) - Winbond

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Компоненты Описание

производитель

Q16DWUUIP
(Rev.:2012)

1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q16DW

3. PACKAGE TYPES AND PIN CONFIGURATIONS

3.1 Pin Configuration SOIC 150 / 208-mil

Top View

/CS

1

8

DO (IO1)

/WP (IO2)

GND

2

7

3

6

4

5

VCC

/HOLD (IO3)

CLK

DI (IO0)

Figure 1a. W25Q16DW Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)

3.2 Pad Configuration WSON 6x5-mm, USON 4x3-mm

Top View

/CS

18

VCC

DO (IO1)

/WP (IO2)

GND

27

36

45

/HOLD (IO3)

CLK

DI (IO0)

Figure 1b. W25Q16DW Pad Assignments, 8-pad WSON 6x5-mm, USON 4x3-mm (Package Code ZP & UU)

3.3 Pin Description SOIC 150 / 208-mil, WSON 6x5-mm, USON 4x3-mm

PIN NO.

1

2

3

4

5

6

7

8

PIN NAME

/CS

DO (IO1)

/WP (IO2)

GND

DI (IO0)

CLK

/HOLD (IO3)

VCC

I/O

FUNCTION

I

Chip Select Input

I/O

Data Output (Data Input Output 1)*1

I/O

Write Protect Input ( Data Input Output 2)*2

Ground

I/O

Data Input (Data Input Output 0)*1

I

Serial Clock Input

I/O

Hold Input (Data Input Output 3)*2

Power Supply

*1 IO0 and IO1 are used for Standard and Dual SPI instructions

*2 IO0 – IO3 are used for Quad SPI/QPI instructions

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