25Q32VFIG Просмотр технического описания (PDF) - Winbond

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Компоненты Описание

производитель

25Q32VFIG

32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

8-Contact 6x5mm WSON Cont’d.

W25Q32V

SYMBOL

M

N

P

Q

R

MILLIMETERS

MIN

TYP.

MAX

MIN

SOLDER PATTERN

3.40

4.30

6.00

0.50

0.75

INCHES

TYP. MAX

0.1338

0.1692

0.2360

0.0196

0.0255

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid

placement of exposed PCB vias under the pad.

- 55 -

Publication Release Date: August 19, 2009

Preliminary - Revision E

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