25Q32VFIG Просмотр технического описания (PDF) - Winbond

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производитель

25Q32VFIG

32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

12. PACKAGE SPECIFICATION

12.1 8-Pin SOIC 208-mil (Package Code SS)

W25Q32V

SYMBOL

A

A1

A2

b

C

D

D1

E

E1

e

H

L

y

θ

MILLIMETERS

MIN

1.75

0.05

1.70

0.35

0.19

5.18

5.13

5.18

5.13

7.70

0.50

-

0°

NOM

1.95

0.15

1.80

0.42

0.20

5.28

5.23

5.28

5.23

1.27 BSC

7.90

0.65

-

-

MAX

2.16

0.25

1.91

0.48

0.25

5.38

5.33

5.38

5.33

8.10

0.80

0.010

8°

MIN

0.069

0.002

0.067

0.014

0.007

0.204

0.202

0.204

0.202

0.303

0.020

-

0°

INCHES

NOM

0.077

0.006

0.071

0.017

0.008

0.208

0.206

0.208

0.206

0.050 BSC

0.311

0.026

-

-

MAX

0.085

0.010

0.075

0.019

0.010

0.212

0.210

0.212

0.210

0.319

0.031

0.004

8°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

- 53 -

Publication Release Date: August 19, 2009

Preliminary - Revision E

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