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UPG2010TB Просмотр технического описания (PDF) - NEC => Renesas Technology

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UPG2010TB
NEC
NEC => Renesas Technology NEC
UPG2010TB Datasheet PDF : 11 Pages
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DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG2010TB
L-BAND SPDT SWITCH
DESCRIPTION
The µPG2010TB is GaAs MMIC for L-band SPDT (Single Pole Double Throw) switch which were developed for
mobile phone and another L-band application.
This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package. And this package is able to high-density surface
mounting.
FEATURES
• Supply voltage
: VDD = 2.7 to 3.0 V (2.8 V TYP.)
• Switch control voltage
: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.)
: Vcont (L) = 0.2 to +0.2 V (0 V TYP.)
• Low insertion loss
: LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
: LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
: LINS3 = 0.35 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V,
Vcont = 2.8 V/0 V (Reference value)
• High isolation
: ISL1 = 28 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
: ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value)
• High power
: Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• L-band digital cellular or cordless telephone
• PCS, W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
µPG2010TB-E3
Package
6-pin super minimold
Marking
G2Y
Supplying Form
Embossed tape 8 mm wide
Pin 1, 2, 3 face the perforation side of the tape
Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG2010TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10317EJ02V0DS (2nd edition)
Date Published October 2003 CP(K)
Printed in Japan
The mark  shows major revised points.
NEC Compound Semiconductor Devices 2003

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