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UPG153TB(1999) Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге
Компоненты Описание
производитель
UPG153TB
(Rev.:1999)
NEC
NEC => Renesas Technology NEC
UPG153TB Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
µPG153TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering method and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: NoneNote
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: NoneNote
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: NoneNote
Pin temperature: 300°C
Time: 3 seconds or less (per pin row)
Exposure limit: NoneNote
Recommended Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet P13632EJ2V0DS00
7

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