UPD4704C Просмотр технического описания (PDF) - NEC => Renesas Technology
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UPD4704C Datasheet PDF : 16 Pages
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µPD4704
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (IEI-1207).
µPD4704G
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
q
* Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”.
TYPES OF THROUGH HOLE MOUNT DEVICE
µPD4704C
Soldering process
Wave soldering
Soldering conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below
REFERENCE
Dcodument name
NEC semiconductor device reliability/quality control system
Quality grade on NEC semiconductor devices
Semiconductor device mounting technology manual
Semiconductor device package manual
Guide to quality assurance for semiconductor devices
Semiconductor selection guide
Symbol
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
11
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