SGA-9189 Просмотр технического описания (PDF) - Stanford Microdevices

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SGA-9189

Reliability Qualification Report

Stanford Microdevices 

SGA-9189 Reliability Qualification Report

Qualification Methodology

The Stanford Microdevices Qualification Procedure consists of a series of tests designed to

stress various potential failure mechanisms. This testing is performed to ensure that

Stanford Microdevices products are robust against potential failure modes that could arise

from the various die and package failure mechanisms stressed. The qualification testing is

based on JEDEC test methods common to the semiconductor industry. For the tests

requiring full RF and DC testing to determine PASS/FAIL, the manufacturing test

specifications are used as the PASS/FAIL criteria.

Qualification By Similarity

A device can be qualified by similarity to previously qualified products provided that no

new potential failure modes/mechanisms are possible in the new design as compared

to the qualified design. The following product has been qualified by similarity to SGA-9189

SGA-9289

Qualification Results

Group Test Description

Test Standard

A0 Moisture Preconditioning / IR Reflow Simulation JEDEC 22-A113B

A1 Temp Cyle -65°c to 150°c 1000 cycles

JEDEC 22-A104A

A2 High Temp Operating Life 1000 hrs.

JEDEC 22-A108A

C Autoclave 121°c 15 PSI 96 hrs.

JEDEC 22-A102B

E Solderbility Steam Age

JEDEC 22-B102C

G High Temp Storage 1000 hrs T= 150°C

JEDEC 22-A103A

Quantity

In

650

120

189

80

44

83

Quantity

Out

650

120

189

80

44

83

Results

PASS

PASS

PASS

PASS

PASS

PASS

Table 1: Qualification Test Results for SGA-9189.

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