SNA-500 Просмотр технического описания (PDF) - Stanford Microdevices
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SNA-500 Datasheet PDF : 3 Pages
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SNA-500 DC-3 GHz Cascadable MMIC Amplifier
Absolute Maximum Ratings
Param eter
D evic e C urrent
Power Dissipation
RF Input Power
Ju n ction Te m p e ra ture
O p e ra tin g Te m p e ra tu re
Sto ra g e Te m pe ra tu re
A bsolute
M axim um
130m A
750m W
200m W
+200C
-45C to +85C
-65C to +150C
Notes:
1. Operation of this device above any one of
these parameters may cause permanent
damage.
MTTF vs. Temperature @ Id = 70mA
Die Bottom
Temperature
Junction
MTTF (hrs)
Temperature
+65C
+155C
1000000
+100C
+190C
100000
+130C
+220C
10000
Thermal Resistance (Lead-Junction): 265° C/W
Die Attach
The die attach process mechanically attaches the die to
the circuit substrate. In addition, it electrically connects
the ground to the trace on which the die is mounted and
establishes the thermal path by which heat can leave the
die.
Assembly Techniques
Epoxy die attach is recommended. The top and bottom
metallization is gold. Conductive silver-filled epoxies are
recommended. This method involves the use of epoxy to
form a joint between the backside gold of the chip and
the metallized area of the substrate. A 150 C cure for 1
hour is necessary. Recommended epoxy is Ablebond
84-1LMIT1 from Ablestik.
Part Number Ordering Information
Part Number Devices Per Pak
SNA-500
100
6.0
5.0
Typical Biasing Configuration
Wire Bonding
Electrical connections to the die are through wire
bonds. Stanford Microdevices recommends wedge
bonding or ball bonding to the pads of these devices.
Recommended Wedge Bonding Procedure
1. Set the heater block temperature to 260C +/- 10C.
2. Use pre-stressed (annealed) gold wire between
0.0005 to 0.001 inches in diameter.
3. Tip bonding pressure should be between 15 and
20 grams and should not exceed 20 grams. The
footprint that the wedge leaves on the gold wire
should be between 1.5 and 2.5 wire diameters
across for a good bond.
522 Almanor Ave., Sunnyvale, CA 94086
Phone: (800) SMI-MMIC
5-71
http://www.stanfordmicro.com
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