µPD16833A
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions described below.
For soldering methods and conditions other than those listed below, consult NEC.
For the details of the recommended soldering conditions of this type, refer to the Semiconductor Device Mounting
Technology Manual (C10535E).
Soldering Method
Infrared reflow
VPS
Wave soldering
Soldering Conditions
Symbol of Recommended
Soldering
Peak package temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.),
Number of times: 3 MAX., Number of days: NoneNote, Flux: Rosin-based
flux with little chlorine content (chlorine: 0.2 Wt% MAX.) is recommended.
IR35-00-3
Peak package temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),
(200 °C MIN.), Number of times: 2 MAX., Number of days: NoneNote,
Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% MAX.)
is recommended.
VP15-00-2
Soldering bath temperature: 260 °C MAX., Time: 10 seconds MAX.,
Preheating temperature: 120 °C MAX.,
Number of times: 1, Flux: Rosin-based flux with little chlorine content
(chlorine: 0.2 Wt% MAX.) is recommended.
WS60-00-1
Note The number of storage days at 25 °C, 65% RH after the dry pack has been opened
Caution Do not use two or more soldering methods in combination.
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