UPD16650N Просмотр технического описания (PDF) - NEC => Renesas Technology

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производитель

UPD16650N

120-/128-OUTPUT TFT-LCD GATE DRIVER

NEC => Renesas Technology 

µPD16650

RECOMMENDED MOUNTING CONDITIONS

When mounting this product, please make sure that the following recommended conditions are satisfied.

For packaging methods and conditions other than those recommended below, please contact NEC sales

personnel.

µPD16650N-×××

Mounting Condition

Mounting Method

Condition

Thermocompression Soldering

Heating tool 300 to 350 ˚C; heating for 2 to 3 seconds; pressure 100 g

(per solder)

ACF (Sheet-shape bonding

agent)

Temporary bonding 70 to 100 ˚C; pressure 3 to 8 kg/cm2; time 3 to 5

secs.

Real bonding 165 to 180 ˚C; pressure 25 to 45 kg/cm2; time 30 to 40

secs. (when using the anisotropic conductive film SUMIZAC1003 of

Sumitomo Bakelite, Ltd.)

Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more packaging methods at a time.

Reference

NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)

Quality Grades to NEC’s Semiconductor Devices (IEI-1209)

11

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