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UPC305C Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге
Компоненты Описание
производитель
UPC305C
NEC
NEC => Renesas Technology NEC
UPC305C Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
µPC305
RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface Mount Type
µPC305G2: 8-pin plastic SOP (5.72 mm (225))
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Package peak temperature: 230°C, Time: 30 sec max. (210°C min.),
Number of times: once
Package peak temperature: 215°C, Time: 40 sec max. (200°C min.),
Number of times: once
Solder bath temperature: 260°C max., Time: 10 sec max., Number of times: once,
Preheating temperature: 120°C max. (Package surface temperature)
Recommended
Conditions Symbol
IR30-00-1
VP15-00-1
WS60-00-1
Caution Do not use two or more soldering methods in combination (except partial heating).
Through Hole type
µPC305C: 8-pin plastic DIP (7.62 mm (300))
Soldering Method
Soldering Conditions
Wave soldering
Solder bath temperature: 260°C max., Time: 10 sec max.
Recommended
Conditions Symbol
Data Sheet G10633EJ3V0DS00
7

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