UPC1944T-E2 Просмотр технического описания (PDF) - NEC => Renesas Technology

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производитель

UPC1944T-E2

ADJUSTABLE PRECISION SHUNT REGULATORS

NEC => Renesas Technology 

µ PC1943,1944

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, there are highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to

consult with our sales offices.

For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).

Type of Surface Mount Device

µ PC1943T, 1944T : Power mini mold (SOT-89)

Process

Conditions

Symbol

Infrared ray reflow

VPS

Wave soldering

Peak temperature: 235 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 2 times.

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 2 times.

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

IR35-00-2

VP15-00-2

WS60-00-1

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

µ PC1944GR : 8-pin plastic SOP (5.72 mm (225))

Process

Infrared ray reflow

VPS

Wave soldering

Conditions

Peak temperature: 235 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 1 time.

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 1 time.

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

Symbol

IR35-00-1

VP15-00-1

WS60-00-1

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

Type of Through-hole Device

µ PC1944J : 3-pin plastic SIP (TO-92)

Process

Conditions

Wave soldering (only to leads)

Solder temperature: 260 °C or below, Flow time: 10 seconds or less.

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

Data Sheet G10239EJ3V0DS00

9

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