UBA2024(2004) Просмотр технического описания (PDF) - Philips Electronics
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UBA2024 Datasheet PDF : 11 Pages
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Philips Semiconductors
Half-bridge power IC for CFL lamps
Product specification
UBA2024
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to
SGND; positive currents flow into the IC.
SYMBOL
PARAMETER
VHV
high-voltage supply voltage
VFS
floating supply voltage
VDD
low-voltage output supply voltage
IDD
low-voltage output supply current
VPGND
Vi(RC)
Vi(SW)
SR
Tj
Tamb
Tstg
Vesd(HBM)
Vesd(MM)
power ground voltage
internal oscillator input voltage on pin RC
sweep time input voltage on pin SW
slew rate output on pin OUT
junction temperature
ambient temperature
storage temperature
HBM electrostatic discharge voltage on pins
HV and VDD
SW, RC, FS and OUT
MM electrostatic discharge voltage on pins
FS
HV, VDD, SW, RC and OUT
CONDITIONS
normal operation
mains transients
during 0.5 s
DC supply
peak value is internally
limited; Tamb = 25 °C
referenced to SGND
Ii(RC) < 1 mA
Ii(SW) < 1 mA
repetitive
note 1
note 2
MIN.
−
−
MAX.
373
550
UNIT
V
V
VHV
VHV + 14 V
0
14
V
0
5
mA
−1
+1
V
0
VDD
V
0
VDD
V
−4
+4
V/ns
−40
+150
°C
−40
+150
°C
−55
+150
°C
−
1 000
V
−
2 500
V
−
200
V
−
250
V
Notes
1. In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ
series resistor.
2. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 kΩ series
resistor and a 0.75 µH inductor.
QUALITY SPECIFICATION
Quality in accordance with SNW-FQ-611.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth(j-a)
Rth(j-c)
thermal resistance from junction to ambient
thermal resistance from junction to case
Note
1. In accordance with IEC 60747-1.
CONDITIONS
in free air; note 1
note 1
TYP.
95
16
UNIT
K/W
K/W
2004 Feb 03
5
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