TZA3044U Просмотр технического описания (PDF) - Philips Electronics
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Компоненты Описание
производитель
TZA3044U Datasheet PDF : 28 Pages
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Philips Semiconductors
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postamplifiers
BONDING PADS
SYMBOL
SUB
TEST
AGND
AGND
n.c.
AGND
DIN
DINQ
AGND
TEST
VCCA
VCCA
CF
SUB
TEST
JAM
STQ
ST
DGND
DGND
TEST
DGND
DOUTQ
DOUT
DGND
TEST
VCCD
VCCD
Vref
RSET
n.c.
n.c.
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COORDINATES(1)
X
−235.7
−392.8
−532.8
−647.8
−647.8
−647.8
−647.8
−647.8
−647.8
−647.8
−647.8
−532.8
−392.8
−235.7
−78.6
+61.4
+218.5
+375.6
+532.7
+647.8
+647.8
+647.8
+647.8
+647.8
+647.8
+647.8
+647.8
+532.7
+392.7
+235.6
+78.5
−78.6
Y
+647.8
+647.8
+647.8
+507.1
+350.0
+210.0
+70.0
−70.0
−210.0
−350.0
−507.1
−647.8
−647.8
−647.8
−647.8
−647.8
−647.8
−647.8
−647.8
−507.1
−350.0
−210.0
−70.0
+70.0
+210.0
+350.0
+507.1
+647.8
+647.8
+647.8
+647.8
+647.8
Note
1. The x and y coordinates represent the position of the
centre of the pad with respect to the centre of the die
(see Fig.27).
1999 Nov 03
20
Product specification
TZA3044; TZA3044B
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