TZA3044U Просмотр технического описания (PDF) - Philips Electronics

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TZA3044U

SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers

Philips Electronics 

Philips Semiconductors

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

Product specification

TZA3044; TZA3044B

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

VCC

Vn

In

Ptot

Tstg

Tj

Tamb

PARAMETER

supply voltage

DC voltage

pins DIN, DINQ, CF, JAM and RSET

pins ST, STQ, DOUT and DOUTQ

pin Vref

DC current

pins DIN, DINQ, CF and JAM

pins ST, STQ, DOUT and DOUTQ

pin Vref

pin RSET

total power dissipation

storage temperature

junction temperature

ambient temperature

CONDITIONS

MIN.

−0.5

note 1

−0.5

VCC − 2

−0.5

−1

−25

−2

−2

−

−65

−

−40

Note

1. For the TZA3044B the minimum value is −0.5 V for ST and STQ outputs.

MAX.

+6

UNIT

V

VCC + 0.5 V

VCC + 0.5 V

+3.2

V

+1

mA

+10

mA

+2.5

mA

+2

mA

300

mW

+150

°C

150

°C

+85

°C

HANDLING

This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through

electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can

be obtained by bonding the VCC and GND pads first, the remaining pads may then be bonded to their external

connections in any order.

THERMAL CHARACTERISTICS

SYMBOL

Rth(j-a)

PARAMETER

thermal resistance from junction to ambient

SO16 package

TSSOP16 package

CONDITIONS

note 1

VALUE

115

150

UNIT

K/W

K/W

Note

1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided

57 × 57 × 1.6 mm FR4 epoxy printed-circuit board with 35 µm thick copper traces. The measurements are performed

in still air.

1999 Nov 03

10

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