Philips Semiconductors
1.25 Gbits/s Gigabit Ethernet postamplifiers
Objective specification
TZA3044T; TZA3044U
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VCC
Vn
In
Ptot
Tstg
Tj
Tamb
supply voltage
DC voltage
pins 4 and 5 (7 and 8): DIN and DINQ
pin 7 (13): CF
pin 8 (16): JAM
pins 9, 10, 12 and 13 (17, 18, 23 and 24):
STQ, ST, DOUTQ and DOUT
pin 15 (29): Vref
pin 16 (30): RSET
DC current
pin 4 and 5 (7 and 8): DIN and DINQ
pin 7 (13): CF
pin 8 (16): JAM
pins 9, 10, 12 and 13 (17, 18, 23 and 24):
STQ, ST, DOUTQ and DOUT
pin 15 (29): Vref
pin 16 (30): RSET
total power dissipation
storage temperature
junction temperature
ambient temperature
note 1
note 1
Note
1. The numbers in brackets refer to the pad numbers of the naked die version.
MIN.
−0.5
−0.5
−0.5
−0.5
VCC − 2
−0.5
−0.5
−1
−1
−1
−25
−2
−2
−
−65
−
−40
MAX.
+6
UNIT
V
VCC + 0.5 V
VCC + 0.5 V
VCC + 0.5 V
VCC + 0.5 V
+3.2
V
VCC + 0.5 V
+1
mA
+1
mA
+1
mA
+10
mA
+2.5
mA
+2
mA
tbf
mW
+150
°C
150
°C
+85
°C
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-s)
Rth(j-a)
PARAMETER
thermal resistance from junction to solder point
thermal resistance from junction to ambient
VALUE
tbf
tbf
UNIT
K/W
K/W
1998 Jul 07
10