TZA3000HL Просмотр технического описания (PDF) - Philips Electronics
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TZA3000HL Datasheet PDF : 20 Pages
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Philips Semiconductors
SDH/SONET STM4/OC12 optical receiver
Objective specification
TZA3000
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
SYMBOL
AGND
VCCA
AGND
DREF
VCCA
AGND
IPhoto
AGND
AGND
BWC
Vref
SUB
DGND
RFTEST
OUTSEL
DGND
VCCD
OUTCML
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
COORDINATES(1)
x
102
102
102
102
102
102
102
102
243
383
523
663
803
943
1 100
1 257
1 398
1 398
y
1 251
1 111
971
814
674
534
395
254
105
105
105
105
105
105
105
105
263
403
SYMBOL
PAD
COORDINATES(1)
x
y
OUTQCML
VCCD
DGND
OUTPECL
OUTQPECL
DGND
DGND
LOS
LOSQ
LOSTTL
LOSTH
AGND
AGC
AGND
19
1 398
20
1 398
21
1 398
22
1 398
23
1 398
24
1 398
25
1 283
26
1 143
27
986
28
829
29
671
30
514
31
357
32
217
543
683
823
963
1 103
1 243
1 400
1 400
1 400
1 400
1 400
1 400
1 400
1 400
Note
1. All coordinates are referenced, in µm, to the bottom
left-hand corner of the die.
handbook, full pagewidth
1997 Oct 17
AGND
VCCA
AGND
1.58 DREF
mm
VCCA
AGND
IPhoto
AGND
32 31 30 29 28 27 26 25
1
24
2
23
3
22
4
TZA3000U
21
5
20
6
19
7
18
8
17
9 10 11 12 13 14 15 16
x
0
0
y
1.58 mm
DGND
OUTQPECL
OUTPECL
DGND
VCCD
OUTQCML
OUTCML
VCCD
MGK882
Fig.3 Bonding pad locations: TZA3000U.
6
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