TSOP69 Просмотр технического описания (PDF) - Vaishali Semiconductor

Номер в каталоге

Компоненты Описание

производитель

TSOP69

IR Receiver Modules for Remote Control Systems

Vaishali Semiconductor 

VISHAY

TSOP69..

Vishay Semiconductors

• Recommended thickness of metal mask is 0.2 mm

for screen printing.

• The recommended reflow furnace is a combination-

type with upper and lower heaters.

• Set the furnace temperatures for pre-heating and

heating in accordance with the reflow temperature

profile as shown below. Excercise extreme care to

keep the maximum temperature below 230 °C. The

following temperature profile means the tempera ture

at the device surface. Since temperature differ ence

occurs between the work and the surface of the circuit

board depending on the pes of circuit board or reflow

furnace, the operating conditions should be verified

prior to start of operation.

• Handling after reflow should be done only after the

work surface has been cooled off.

Manual Soldering

• Use the 6/4 solder or the solder containing silver.

• Use a soldering iron of 25 W or smaller. Adjust the

temperature of the soldering iron below 300 °C.

• Finish soldering within three seconds.

• Handle products only after the temperature is cooled

off.

Cleaning

• Perform cleaning after soldering strictly in conform-

ance to the following conditions:

Cleaning agent:

2-propanol (isopropyl alcohol)

Commercially available grades (industrial use) should

be used.

Demineralized or distilled water having a resistivity of

not less than 500 mΩ corresponding to a conductivity

of 2 mS/m.

• Temperature and time: 30 seconds under the tem-

perature below 50 °C or 3 minutes below 30 °C.

• Ultrasonic cleaning: Below 20 W.

Reflow Solder Profile

240

220

200

180

160

140

120

100

80

60

40

20

0

0

2 qC - 4 qC/s

10 s max.

@ 230 qC

120 s - 180 s 90 s max

2 qC - 4 qC/s

50 100 150 200 250 300 350

Time ( s )

16944

Document Number 84687

Rev. 1.0, 01-Mar-05

www.vishay.com

7

Share Link: