TS274 Просмотр технического описания (PDF) - STMicroelectronics
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TS274 Datasheet PDF : 14 Pages
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Package information
5
Package information
TS274
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5.1
DIP14 package information
Figure 15. DIP14 package mechanical drawing
10/14
Table 5.
Ref.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
DIP14 package mechanical data
Millimeters
Min.
0.51
1.39
1.27
Typ.
0.5
0.25
8.5
2.54
15.24
3.3
Max.
1.65
20
7.1
5.1
2.54
Min.
0.020
0.055
0.050
Inches
Typ.
0.020
0.010
0.335
0.100
0.600
0.130
Max.
0.065
0.787
0.280
0.201
0.100
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