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TLP561G Просмотр технического описания (PDF) - Toshiba

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TLP561G Datasheet PDF : 6 Pages
1 2 3 4 5 6
Absolute Maximum Ratings (Ta = 25°C)
TLP561G
Characteristic
Symbol
Rating
Unit
Forward current
Forward current derating (Ta 53°C)
Peak forward current (100μs pulse, 100pps)
Reverse voltage
Input power dissipation
Input power dissipation derating (Ta 53°C)
Junction temperature
Offstate output terminal voltage
Onstate RMS current
Ta = 25°C
Ta = 70°C
On-state current derating (Ta 25°C)
Peak onstate current (100μs pulse, 120pps)
Peak non-repetitive surge current
(Pw = 10ms)
Output power dissipation
Output power dissipation derating (Ta 25°C)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10s)
Isolation voltage (AC, 60 s, R.H. 60%) (Note 3)
IF
ΔIF / °C
IFP
VR
PD
ΔPD /°C
Tj
VDRM
IT(RMS)
ΔIT / °C
ITP
ITSM
PO
ΔPO / °C
Tj
Tstg
Topr
Tsol
BVS
50
-0.7
1
5
100
-1.4
125
400
100
50
-1.1
2
1.2
300
-3.0
115
-55 to 125
-40 to 100
260
2500
mA
mA / °C
A
V
mW
mW/°C
°C
V
mA
mA / °C
A
A
mW
mW / °C
°C
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc.).
Note 3: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4 and 6 are
shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min Typ. Max Unit
Supply voltage
Forward current
Peak onstate current
Operating temperature
VAC
120 Vac
IF
15
20
25
mA
ITP
1
A
Topr
-25
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
devices. Each item also has its own independent guideline document. In developing designs using these
products, please confirm the specified characteristics shown in these documents.
2
2017-07-10

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