TLP116A(2019) Просмотр технического описания (PDF) - Toshiba
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TLP116A Datasheet PDF : 7 Pages
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TLP116A
Soldering and Storage
1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown
below, irrespectiveof whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used.
The soldering temperature profile is based on the package surface temperature
(See the figure shown above.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow
Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 °C within 10 seconds is recommended
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not
exceeding 350 °C.
Heating by soldering iron must be done only once per lead.
2. Precautions for General Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
© 2019
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Toshiba Electronic Devices & Storage Corporation
2019-10-10
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