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TJA1051 Datasheet PDF : 25 Pages
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NXP Semiconductors
TJA1051
High-speed CAN transceiver
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol
Parameter
Conditions
Min Max
Vx
voltage on pin x[1]
on pins CANH, CANL
on any other pin
58 +58
0.3 +7
V(CANH-CANL) voltage between pin CANH
and pin CANL
27 +27
Vtrt
transient voltage
on pins CANH, CANL
pulse 1
[2]
100 -
pulse 2a
-
75
pulse 3a
150 -
pulse 3b
-
100
VESD
electrostatic discharge voltage IEC 61000-4-2 (150 pF, 330 )
at pins CANH and CANL
[3]
8 +8
Human Body Model (HBM); 100 pF, 1.5 k
[4]
at pins CANH and CANL
8 +8
at any other pin
4 +4
Machine Model (MM); 200 pF, 0.75 H, 10
[5]
at any pin
300 +300
Charged Device Model (CDM); field Induced
[6]
charge; 4 pF
at corner pins
750 +750
at any pin
500 +500
Tvj
virtual junction temperature
Tstg
storage temperature
[7] 40
55
+150
+150
Unit
V
V
V
V
V
V
V
kV
kV
kV
V
V
V
C
C
[1] The device can sustain voltages up to the specified values over the product lifetime, provided applied voltages (including transients)
never exceed these values.
[2] According to IEC TS 62228 (2007), Section 4.2.4; parameters for standard pulses defined in ISO7637 part 2: 2004-06.
[3] According to IEC TS 62228 (2007), Section 4.3; DIN EN 61000-4-2.
[4] According to AEC-Q100-002.
[5] According to AEC-Q100-003.
[6] AEC-Q100-011 Rev-C1. The classification level is C4B.
[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 6. Thermal characteristics
According to IEC 60747-1.
Symbol Parameter
Conditions
Value
Unit
Rth(vj-a)
thermal resistance from virtual junction to ambient SO8 package; in free air
155
K/W
HVSON8 package; in free air 55
K/W
TJA1051
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 28 November 2017
© NXP N.V. 2017. All rights reserved.
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