TICP206LPR Просмотр технического описания (PDF) - Power Innovations Ltd
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TICP206LPR Datasheet PDF : 7 Pages
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TICP206 SERIES
SILICON TRIACS
MARCH 1988 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92)
5,21
4,44
3,43 MIN.
2,67
2,03
4,19
3,17
2,67
2,03
LP003 Falls Within JEDEC
TO-226AA Dimensions
5,34
Seating Plane
4,32
1,27
(see Note AA))
0,56
0,40
1
12,7 MIN.
3
1,40
1,14
2
2,67
2,41
0,41
0,35
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: Lead dimensions are not controlled in this area.
PRODUCT INFORMATION
4
MDXXAX
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